Axial Fan for Wafer Slicing Saw Enclosure from Mexico
Axial fan used in ventilating enclosures for wafer slicing saws to remove dust and debris during boule slicing in semiconductor wafer preparation. Ensures clean environment for precise wafer cuts from monocrystalline material. Falls under HTS 8414.59.65.90 as an other axial fan in semiconductor processing.
Duty Rate — Mexico → United States
27.3%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide diagrams showing integration with wafer slicing saws to confirm semiconductor-specific classification
• Ensure labeling indicates use in cleanroom environments to prevent misclassification as industrial ventilation