Axial Fan for Wafer Slicing Saw Enclosure from China
Axial fan used in ventilating enclosures for wafer slicing saws to remove dust and debris during boule slicing in semiconductor wafer preparation. Ensures clean environment for precise wafer cuts from monocrystalline material. Falls under HTS 8414.59.65.90 as an other axial fan in semiconductor processing.
Duty Rate — China → United States
37.3%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide diagrams showing integration with wafer slicing saws to confirm semiconductor-specific classification
• Ensure labeling indicates use in cleanroom environments to prevent misclassification as industrial ventilation