Wafer Grinding Coolant Pump Shaft from Germany
High-precision shaft for coolant pumps in wafer grinding, lapping, and polishing machines, ensuring vibration-free operation. Falls under HTS 8413.91.9010 as part of 8413.30.90 semiconductor pumps. Critical for maintaining wafer flatness tolerances.
Duty Rate — Germany → United States
15%
Rate breakdown
9903.94.5315%Parts of passenger vehicles and light trucks that are products of the European Union as specified in subdivision (o) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent as provided for in subdivision (m) of U.S. note 33 to this subchapter) rate of duty under column1 less than 15 percent.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Balance certification required for high-speed operation; declare shaft material grade precisely; avoid generic 'pump shaft' descriptions