Semiconductor Lapping Machine Slurry Pump Seal Kit from Japan
Mechanical seal kit with diamond-like carbon coating for slurry pumps in wafer lapping equipment, preventing abrasive leakage. For pumps of HTS 8413.30.90, thus parts in 8413.91.9010. Critical for maintaining flatness in wafer surface preparation.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Seal face material certification required; MTBR data for reliability claims; avoid 'universal seal' generic descriptions