Semiconductor Lapping Machine Slurry Pump Seal Kit from Japan
Mechanical seal kit with diamond-like carbon coating for slurry pumps in wafer lapping equipment, preventing abrasive leakage. For pumps of HTS 8413.30.90, thus parts in 8413.91.9010. Critical for maintaining flatness in wafer surface preparation.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.05.900%Articles of aluminum, of steel or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; patented pharmaceutical articles; and semiconductor articles, as provided in subdivision (f) of U.S. note 52 to this subchapter
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
Import Tips
• Seal face material certification required; MTBR data for reliability claims; avoid 'universal seal' generic descriptions