Czochralski Puller Wafer Slicing Coolant Pump Manifold from Japan
Multi-port manifold distributing coolant to wafer slicing saws in Czochralski systems for semiconductor boule processing. Classifies under HTS 8413.91.9010 as part of 8413.30.90 pumps. Ensures uniform cooling during diamond saw operations.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.94.4315%Parts of passenger vehicles and light trucks that are products of Japan as provided for in subdivision (l) of U.S. note 33 to this subchapter, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 15 percent as provided for in subdivision (m) of U.S. note 33 to this subchapter.
9903.74.110%Articles as provided for in subdivision (l) of U.S. note 38 to this subchapter.
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Port configuration diagrams essential; pressure drop calculations for customs; cleanroom assembly verification