Wafer Slicing Coolant Pump from Japan
Liquid pump delivering coolant to diamond wire saws during wafer slicing from silicon boules in semiconductor fabrication. HTS 8413.81.0040 covers this as other pumps for wafer preparation equipment. Maintains blade temperature for precise, thin wafer cuts without thermal damage.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Document coolant compatibility with silicon materials; ensure FDA-equivalent cleanroom certifications
• Common pitfall: undervaluing high-precision components leading to audits