Wafer Polishing Slurry Feed Pump from Canada
Precision metering pump feeding chemical slurry to polishers preparing wafer surfaces for device fabrication. Classified HTS 8413.81.0040 for semiconductor wafer processing pumps. Delivers uniform slurry for sub-micron surface flatness.
Duty Rate — Canada → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Certify chemical resistance for CMP slurries; include nanofiltration specs
• Common issue: misfiling under chemical dosing pumps