Crystal Ingot Annealing Fluid Pump from Japan
Thermal fluid pump for controlled cooling in silicon ingot annealing furnaces post-growth. Under HTS 8413.81.0040 as pump in wafer manufacturing equipment. Prevents thermal stress cracks in boules.
Duty Rate — Japan → United States
25%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Specify heat transfer fluid ratings; provide annealing process validation
• Pitfall: classification as furnace parts