8412.90.90/Wafer Slicing Saw Spindle Motor/Japan

Wafer Slicing Saw Spindle Motor from Japan

High-precision spindle motor for diamond wafer slicing saws that cut semiconductor boules into thin wafers. Under HTS 8412.90.90 as other motor parts essential for semiconductor wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Provide saw blade RPM tolerance specs and boule material compatibility; classify separately from complete saw assemblies; common pitfall is undervaluation of precision components