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8412.90.90/Wafer Polishing Platen Drive Motor/Japan

Wafer Polishing Platen Drive Motor from Japan

Constant velocity motor for polishing platens achieving mirror-finish wafer surfaces for device fabrication. Falls under HTS 8412.90.90 for semiconductor-specific motor parts.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify polishing slurry compatibility and RPM control; document as replacement part not complete machine; common issue is incorrect Chapter 85 classification