Wafer Polishing Platen Drive Motor from Japan
Constant velocity motor for polishing platens achieving mirror-finish wafer surfaces for device fabrication. Falls under HTS 8412.90.90 for semiconductor-specific motor parts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify polishing slurry compatibility and RPM control; document as replacement part not complete machine; common issue is incorrect Chapter 85 classification