Semiconductor Wafer Polishing Air Motor from Japan
Pneumatic motor designed for driving polishing pads in semiconductor wafer preparation equipment, featuring unlimited rotary action for high-precision surface finishing. Falls under HTS 8412.39.0040 as a specialized pneumatic rotary power engine.
Duty Rate — Japan → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide statistical note documentation linking to wafer lapping/polishing processes
• Use manufacturer specs showing continuous rotation >360 degrees for unlimited classification
• Avoid bulk packaging mislabeling as parts; import as complete motors with testing certs