Semiconductor Wafer Polishing Air Motor from China
Pneumatic motor designed for driving polishing pads in semiconductor wafer preparation equipment, featuring unlimited rotary action for high-precision surface finishing. Falls under HTS 8412.39.0040 as a specialized pneumatic rotary power engine.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide statistical note documentation linking to wafer lapping/polishing processes
• Use manufacturer specs showing continuous rotation >360 degrees for unlimited classification
• Avoid bulk packaging mislabeling as parts; import as complete motors with testing certs