Wafer Crystal Grinder Turbine Assembly from China
High-precision turbine assembly powers diamond grinders that shape silicon boules to exact wafer diameters and grind orientation flats indicating resistivity. Falls under HTS 8411.99.90 as gas turbine parts for semiconductor wafer preparation equipment. Provides sub-micron precision grinding essential before wafer slicing.
Duty Rate — China → United States
39.9%
Rate breakdown
9903.05.3112.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of China, as provided for in U.S. note 52 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include metrology certificates proving grinder achieves <1μm flatness tolerances required for semiconductor wafers
• Document turbine RPM range (10,000-50,000) and diamond wheel specifications in entry paperwork
• Avoid misclassification by specifying semiconductor boule application vs general metal grinding