Silicon Wafer Lapping Turbine Head from China
Turbine-driven lapping heads use colloidal slurries to achieve wafer flatness within 0.1μm across 300mm diameters, preparing surfaces for epitaxial growth. Classified under HTS 8411.99.90 as gas turbine parts for semiconductor wafer preparation equipment. Maintains constant pressure and orbital motion during double-side lapping.
Duty Rate — China → United States
37.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include slurry compatibility specs and achieved total thickness variation (TTV <0.5μm) metrics
• Declare pad material (cast iron, polyurethane) and pressure ranges specific to silicon carbide/gallium arsenide
• Distinguish from CMP equipment by emphasizing lapping's stock removal vs polishing function