Semiconductor Wafer Slicing Turbine Spindle from Japan
Inner diameter diamond saw turbine spindles rotate at 30,000+ RPM to slice ultra-thin wafers (25-150μm) from silicon boules with minimal subsurface damage. HTS 8411.99.90 covers these as other gas turbine parts specifically for semiconductor wafer manufacturing equipment. Precision speed control prevents crystal lattice damage during kerfless slicing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify diamond blade specifications (ID saw, kerf width <100μm) and achieved wafer thickness uniformity
• Provide vibration analysis data showing <0.1μm runout essential for semiconductor wafer quality
• Classify as complete slicing machine parts, not standalone turbine components to maintain 84.11 status