Gallium Arsenide Wafer Polishing Turbine from Japan
High-speed turbine powers chemical-mechanical polishers that remove final 1-2μm of silicon/gallium arsenide wafers to mirror finish (<0.5nm RMS). HTS 8411.99.90 as other gas turbine parts for semiconductor wafer fabrication preparation. Enables defect-free surfaces for photolithography processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify CMP slurry chemistry (silica, ceria) and achieved surface roughness metrics for classification
• Document platen rotation speeds (50-150 RPM) and downforce control (1-5 psi) parameters
• Include material safety data for gallium arsenide handling and waste treatment requirements