Gallium Arsenide Wafer Polishing Turbine from Japan
High-speed turbine powers chemical-mechanical polishers that remove final 1-2μm of silicon/gallium arsenide wafers to mirror finish (<0.5nm RMS). HTS 8411.99.90 as other gas turbine parts for semiconductor wafer fabrication preparation. Enables defect-free surfaces for photolithography processing.
Duty Rate — Japan → United States
12.4%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify CMP slurry chemistry (silica, ceria) and achieved surface roughness metrics for classification
• Document platen rotation speeds (50-150 RPM) and downforce control (1-5 psi) parameters
• Include material safety data for gallium arsenide handling and waste treatment requirements