Gallium Arsenide Wafer Polishing Turbine from Germany
High-speed turbine powers chemical-mechanical polishers that remove final 1-2μm of silicon/gallium arsenide wafers to mirror finish (<0.5nm RMS). HTS 8411.99.90 as other gas turbine parts for semiconductor wafer fabrication preparation. Enables defect-free surfaces for photolithography processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify CMP slurry chemistry (silica, ceria) and achieved surface roughness metrics for classification
• Document platen rotation speeds (50-150 RPM) and downforce control (1-5 psi) parameters
• Include material safety data for gallium arsenide handling and waste treatment requirements