Wafer Slicing Saw Drive Turbine from Japan
Gas turbine drive unit for wafer slicing saws that cut monocrystalline boules into thin semiconductor wafers. Classified in 8411.99.9085 as parts of non-aircraft gas turbines integral to wafer preparation equipment. Delivers consistent high-speed rotation for precise kerf-less cuts.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Submit engineering drawings proving integration with wafer saw; comply with precision machinery vibration standards; check for ITAR restrictions if dual-use technology