Wafer Lapping Turbine Drive from Japan
Gas turbine drive system for wafer lappers that achieve ultra-flat surfaces on semiconductor wafers prior to fabrication. Classified 8411.99.9085 as part of non-aircraft gas turbine in wafer preparation equipment. Critical for bringing wafers within strict dimensional tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide flatness specification data (bow/warp measurements); include material compatibility certificates; budget for additional testing fees at entry