Wafer Lapping Turbine Drive from Japan
Gas turbine drive system for wafer lappers that achieve ultra-flat surfaces on semiconductor wafers prior to fabrication. Classified 8411.99.9085 as part of non-aircraft gas turbine in wafer preparation equipment. Critical for bringing wafers within strict dimensional tolerances.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Provide flatness specification data (bow/warp measurements); include material compatibility certificates; budget for additional testing fees at entry