CMP Polisher Gas Turbine from Japan
High-speed gas turbine for Chemical Mechanical Planarization (CMP) polishers preparing semiconductor wafer surfaces for device fabrication. HTS 8411.99.9085 covers this non-aircraft gas turbine part essential for wafer polishers in semiconductor processing.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include slurry compatibility documentation; verify cleanroom class certification; expect extended CBP review for advanced semiconductor equipment