Steam Turbine-Driven Wafer Grinder Rotating Blades from Japan
Rotating blades for wafer grinders powered by steam turbines, used to grind semiconductor crystal boules to precise diameters post-growth. They ensure accurate flats indicating conductivity type for wafer production. HTS 8406.90.40.00 covers these as rotating blades of steam turbines in semiconductor wafer preparation.
Duty Rate — Japan → United States
30%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• Submit OEM certification linking blades to steam turbine models used in semiconductor grinders
• Comply with dimensional tolerance declarations (e.g
• micron-level flatness specs) for classification support
• Avoid reclassification by separating from lapping/polishing consumables on import manifests