Steam Turbine-Driven Wafer Grinder Rotating Blades from China
Rotating blades for wafer grinders powered by steam turbines, used to grind semiconductor crystal boules to precise diameters post-growth. They ensure accurate flats indicating conductivity type for wafer production. HTS 8406.90.40.00 covers these as rotating blades of steam turbines in semiconductor wafer preparation.
Duty Rate — China → United States
40%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Submit OEM certification linking blades to steam turbine models used in semiconductor grinders
• Comply with dimensional tolerance declarations (e.g
• micron-level flatness specs) for classification support
• Avoid reclassification by separating from lapping/polishing consumables on import manifests