Silicon Wafer Lapping Stationary Turbine Blades from Japan
Stationary blades in steam turbine-driven lappers that flatten silicon wafer surfaces to nanometer tolerances post-slicing for semiconductor fabrication. They guide lapping plates for ultimate flatness. Under HTS 8406.90.40.00 as stationary parts of steam turbines in wafer preparation equipment.
Duty Rate — Japan → United States
15%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) linking to semiconductor standards
• Avoid bulk packaging that suggests tool status; ship as assembled turbine components
• Ensure no confusion with polishing pads classified under 6804 or 5910