Silicon Wafer Lapping Stationary Turbine Blades from Germany
Stationary blades in steam turbine-driven lappers that flatten silicon wafer surfaces to nanometer tolerances post-slicing for semiconductor fabrication. They guide lapping plates for ultimate flatness. Under HTS 8406.90.40.00 as stationary parts of steam turbines in wafer preparation equipment.
Duty Rate — Germany → United States
30%
Rate breakdown
9903.82.0925%Except as provided for in headings 9903.82.16, 9903.82.20–9903.82.26 and 9903.85.68, articles of copper and derivative aluminum and steel articles, as provided for in subdivisions (c)(vi)–(viii) and (xi) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) linking to semiconductor standards
• Avoid bulk packaging that suggests tool status; ship as assembled turbine components
• Ensure no confusion with polishing pads classified under 6804 or 5910