Silicon Wafer Lapping Stationary Turbine Blades from China
Stationary blades in steam turbine-driven lappers that flatten silicon wafer surfaces to nanometer tolerances post-slicing for semiconductor fabrication. They guide lapping plates for ultimate flatness. Under HTS 8406.90.40.00 as stationary parts of steam turbines in wafer preparation equipment.
Duty Rate — China → United States
40%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0325%Except as provided in headings 9903.88.13, 9903.88.18, 9903.88.33, 9903.88.34, 9903.88.35, 9903.88.36, 9903.88.37, 9903.88.38, 9903.88.40, 9903.88.41, 9903.88.43, 9903.88.45, 9903.88.46, 9903.88.48, 9903.88.56, 9903.88.64, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(e) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(f)
Import Tips
• Provide flatness tolerance data (e.g
• <1 micron) linking to semiconductor standards
• Avoid bulk packaging that suggests tool status; ship as assembled turbine components
• Ensure no confusion with polishing pads classified under 6804 or 5910