8406.82.90.00/Wafer Lapping Polisher Turbine/Japan

Wafer Lapping Polisher Turbine from Japan

Small steam turbine for driving lappers and polishers that achieve flatness tolerances on semiconductor wafers before fabrication. Under HTS 8406.82.90.00 for other vapor turbines ≤40 MW in wafer preparation per chapter statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Highlight surface flatness specs in import declaration for proper classification

• Provide cleanroom compatibility certifications

• Watch for reclassification if polishing pads included as set