Wafer Lapping Polisher Turbine from Japan
Small steam turbine for driving lappers and polishers that achieve flatness tolerances on semiconductor wafers before fabrication. Under HTS 8406.82.90.00 for other vapor turbines ≤40 MW in wafer preparation per chapter statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Highlight surface flatness specs in import declaration for proper classification
• Provide cleanroom compatibility certifications
• Watch for reclassification if polishing pads included as set