8406.82.90.00/Wafer Lapping Polisher Turbine/Japan

Wafer Lapping Polisher Turbine from Japan

Small steam turbine for driving lappers and polishers that achieve flatness tolerances on semiconductor wafers before fabrication. Under HTS 8406.82.90.00 for other vapor turbines ≤40 MW in wafer preparation per chapter statistical notes.

Duty Rate — Japan → United States

10%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Calculate with your customs valueVerify classification with AI

Import Tips

• Highlight surface flatness specs in import declaration for proper classification

• Provide cleanroom compatibility certifications

• Watch for reclassification if polishing pads included as set

Wafer Lapping Polisher Turbine from Japan — Import Duty Rate | HTS 8406.82.90.00