8406.82.90.00/Wafer Lapping Polisher Turbine/China

Wafer Lapping Polisher Turbine from China

Small steam turbine for driving lappers and polishers that achieve flatness tolerances on semiconductor wafers before fabrication. Under HTS 8406.82.90.00 for other vapor turbines ≤40 MW in wafer preparation per chapter statistical notes.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Highlight surface flatness specs in import declaration for proper classification

• Provide cleanroom compatibility certifications

• Watch for reclassification if polishing pads included as set

Wafer Lapping Polisher Turbine from China — Import Duty Rate | HTS 8406.82.90.00