Vapor Turbine for Wafer Polishing from Mexico
Steam turbine powering chemical mechanical planarization (CMP) polishers for semiconductor wafer surface finishing. HTS 8406.82.90.00 applies to this other turbine in wafer preparation equipment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Describe CMP slurry flow and platen rotation specs
• Ensure classification excludes testing polishers in Chapter 90
• Include removal rate data for process validation