Vapor Turbine for Wafer Polishing from Japan
Steam turbine powering chemical mechanical planarization (CMP) polishers for semiconductor wafer surface finishing. HTS 8406.82.90.00 applies to this other turbine in wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Describe CMP slurry flow and platen rotation specs
• Ensure classification excludes testing polishers in Chapter 90
• Include removal rate data for process validation