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8406.82.90.00/Vapor Turbine for Wafer Polishing/Japan

Vapor Turbine for Wafer Polishing from Japan

Steam turbine powering chemical mechanical planarization (CMP) polishers for semiconductor wafer surface finishing. HTS 8406.82.90.00 applies to this other turbine in wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Describe CMP slurry flow and platen rotation specs

• Ensure classification excludes testing polishers in Chapter 90

• Include removal rate data for process validation

Vapor Turbine for Wafer Polishing from Japan — Import Duty Rate | HTS 8406.82.90.00