Vapor Turbine for Wafer Polishing from Germany
Steam turbine powering chemical mechanical planarization (CMP) polishers for semiconductor wafer surface finishing. HTS 8406.82.90.00 applies to this other turbine in wafer preparation equipment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Describe CMP slurry flow and platen rotation specs
• Ensure classification excludes testing polishers in Chapter 90
• Include removal rate data for process validation