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8406.82.90.00/Vapor Turbine for Wafer Polishing/China

Vapor Turbine for Wafer Polishing from China

Steam turbine powering chemical mechanical planarization (CMP) polishers for semiconductor wafer surface finishing. HTS 8406.82.90.00 applies to this other turbine in wafer preparation equipment.

Duty Rate — China → United States

35%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
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Import Tips

• Describe CMP slurry flow and platen rotation specs

• Ensure classification excludes testing polishers in Chapter 90

• Include removal rate data for process validation

Vapor Turbine for Wafer Polishing from China — Import Duty Rate | HTS 8406.82.90.00