8406.82.90.00/Semiconductor boule Slicer Turbine/Japan

Semiconductor boule Slicer Turbine from Japan

Turbine component in wire saw systems slicing semiconductor boules into thin wafers with minimal kerf loss. Fits HTS 8406.82.90.00 as other turbine for wafer slicing saws in statistical note (a)(ii)(B).

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Detail wire tension and speed controls for classification accuracy

• Include kerf loss specs to prove semiconductor optimization

• Bundle with saw blades only if not creating a set under GRI 3