Semiconductor boule Slicer Turbine from Japan
Turbine component in wire saw systems slicing semiconductor boules into thin wafers with minimal kerf loss. Fits HTS 8406.82.90.00 as other turbine for wafer slicing saws in statistical note (a)(ii)(B).
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Detail wire tension and speed controls for classification accuracy
• Include kerf loss specs to prove semiconductor optimization
• Bundle with saw blades only if not creating a set under GRI 3