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8406.82.90.00/Precision Wafer Grinder Turbine/Mexico

Precision Wafer Grinder Turbine from Mexico

Low-output vapor turbine in back-grinding machines reducing wafer thickness for advanced semiconductor packaging. HTS 8406.82.90.00 for other turbines in wafer grinder apparatus per statistical notes.

Duty Rate — Mexico → United States

10%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify post-grind thickness tolerances (<50μm typical)

• Document diamond wheel compatibility

• Avoid general grinder classification by emphasizing semiconductor wafers