Precision Wafer Grinder Turbine from Japan
Low-output vapor turbine in back-grinding machines reducing wafer thickness for advanced semiconductor packaging. HTS 8406.82.90.00 for other turbines in wafer grinder apparatus per statistical notes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify post-grind thickness tolerances (<50μm typical)
• Document diamond wheel compatibility
• Avoid general grinder classification by emphasizing semiconductor wafers