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8406.82.90.00/Precision Wafer Grinder Turbine/Japan

Precision Wafer Grinder Turbine from Japan

Low-output vapor turbine in back-grinding machines reducing wafer thickness for advanced semiconductor packaging. HTS 8406.82.90.00 for other turbines in wafer grinder apparatus per statistical notes.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify post-grind thickness tolerances (<50μm typical)

• Document diamond wheel compatibility

• Avoid general grinder classification by emphasizing semiconductor wafers

Precision Wafer Grinder Turbine from Japan — Import Duty Rate | HTS 8406.82.90.00