Precision Wafer Grinder Turbine from Germany
Low-output vapor turbine in back-grinding machines reducing wafer thickness for advanced semiconductor packaging. HTS 8406.82.90.00 for other turbines in wafer grinder apparatus per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify post-grind thickness tolerances (<50μm typical)
• Document diamond wheel compatibility
• Avoid general grinder classification by emphasizing semiconductor wafers