Precision Wafer Grinder Turbine from Germany
Low-output vapor turbine in back-grinding machines reducing wafer thickness for advanced semiconductor packaging. HTS 8406.82.90.00 for other turbines in wafer grinder apparatus per statistical notes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify post-grind thickness tolerances (<50μm typical)
• Document diamond wheel compatibility
• Avoid general grinder classification by emphasizing semiconductor wafers