Electronics Metal Lead Frame Punch from Japan
Precision punch for cutting lead frames from copper alloy strips in semiconductor packaging presses. Under HTS 8207.30.30.20 for fine metal punching tools. Critical for microelectronics assembly.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Comply with export controls for semiconductor tools
• Anti-dumping on Asian copper tools