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8207.30.30.20/Electronics Metal Lead Frame Punch/Japan

Electronics Metal Lead Frame Punch from Japan

Precision punch for cutting lead frames from copper alloy strips in semiconductor packaging presses. Under HTS 8207.30.30.20 for fine metal punching tools. Critical for microelectronics assembly.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Comply with export controls for semiconductor tools

• Anti-dumping on Asian copper tools

Electronics Metal Lead Frame Punch from Japan — Import Duty Rate | HTS 8207.30.30.20