High-Purity Rhenium Sputtering Target Powder from Japan
Rhenium powder specifically prepared for plasma sputtering to deposit thin films in semiconductors. Classified as unwrought powder under HTS 8112.41.50.00 since not formed into sputtering targets yet. Critical for microelectronics manufacturing.
Duty Rate — Japan → United States
3%
Rate breakdown
9903.05.860%Articles provided for in subdivision (b) of U.S. note 52 to this subchapter
Import Tips
• Include supplier specs confirming no binders/additives to maintain unwrought status
• Declare vacuum-sealed packaging to prevent auto-oxidation claims at entry
• Watch for ITAR restrictions; provide civilian end-use certification