Manganese Target Plates for Sputtering from Japan
Polished manganese plates used as sputtering targets in thin-film deposition for semiconductors. Falls under HTS 8111.00.60.00 as 'other' manganese articles, specifically fabricated for vacuum coating processes. Meets base metal purity standards.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include sputtering process specs to justify article classification
• Test for surface purity; contamination risks alloy status under Chapter 81
• Comply with export controls for semiconductor materials