Manganese Target Plates for Sputtering from Japan
Polished manganese plates used as sputtering targets in thin-film deposition for semiconductors. Falls under HTS 8111.00.60.00 as 'other' manganese articles, specifically fabricated for vacuum coating processes. Meets base metal purity standards.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include sputtering process specs to justify article classification
• Test for surface purity; contamination risks alloy status under Chapter 81
• Comply with export controls for semiconductor materials