Tin-Lead Solder Alloy Ingot from Japan
An unwrought ingot composed of tin alloy with over 25% lead content by weight, used primarily for electronics soldering applications. This falls under HTS 8001.20.00.90 as it meets the definition of tin alloys where tin predominates but lead exceeds 25% by weight, distinguishing it from pure tin or low-lead alloys.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Verify exact lead content via certified assay reports to confirm >25% threshold and avoid reclassification to lower-lead tin alloys
• Include material safety data sheets (MSDS) documenting RoHS exemptions for leaded solders in electronics
• Watch for anti-dumping duties on certain tin-lead alloys from specific origins; check Commerce Department updates