Tin-Lead Solder Alloy Ingot (3% Lead) from Japan
An unwrought tin alloy ingot containing 97% tin and 3% lead, designed for melting into solder wire or bars. It falls under HTS 8001.20.00.10 as a tin alloy with 5% or less lead by weight, meeting the chapter definition where tin predominates and total other elements exceed 1%. Commonly used in electronics assembly.
Duty Rate — Japan → United States
0%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Verify exact lead content via assay certificate to confirm ≤5% for this subheading; misclassification risks penalties
• Provide mill test reports showing tin predominance (>50% by weight) and compliance with chapter note (b) for tin alloys
• Avoid common pitfall of declaring as pure tin (8001.10); alloys with >1% other elements must use 8001.20