High-Purity Lead Powder for Electronics from Japan
99.99% pure micronized lead powder used in lead-tin solder paste production for electronics assembly. HTS 7804.20.00.00 for pure lead powders.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify RoHS exemptions for lead in soldering applications with end-use statements
• Lab test for particle size <10 microns to match electronics grade specs
• Store and ship under nitrogen to prevent surface oxidation affecting solder quality