Electronic Packaging Al-Si Alloy from Japan
High-silicon (25%) aluminum alloy ingots for low-expansion electronic packaging and heat sinks. Meets HTS 7601.20.60.00 unwrought criteria with specified silicon content matching CTE requirements. Alternative to Kovar for hermetic seals.
Duty Rate — Japan → United States
52.1%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.03.060%Articles of aluminum, of steel, or of copper or derivative aluminum or steel articles; passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; parts of passenger vehicles (sedans, sport utility vehicles, crossover utility vehicles, minivans, and cargo vans) and light trucks; medium- and heavy-duty vehicles; parts of medium- and heavy-duty vehicles; wood products; and semiconductor articles, of any country, as provided in subdivision (aa)(v) of U.S. note 2 to this subchapter
Import Tips
• CTE specification sheets prove alloy purpose; clean ingot surface required for electronics; RoHS compliance documentation mandatory