Electronic Packaging Al-Si Alloy from Japan
High-silicon (25%) aluminum alloy ingots for low-expansion electronic packaging and heat sinks. Meets HTS 7601.20.60.00 unwrought criteria with specified silicon content matching CTE requirements. Alternative to Kovar for hermetic seals.
Duty Rate — Japan → United States
52.1%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• CTE specification sheets prove alloy purpose; clean ingot surface required for electronics; RoHS compliance documentation mandatory