Unbacked Refined Copper Foil for Coinage Dies from Japan
Pure refined copper foil, 0.12mm thick, used for stamping coinage dies and medallions. Meets HTS 7410.11.00.00 as not backed, refined copper foil ≤0.15mm. Its malleability suits precision minting applications.
Duty Rate — Japan → United States
11%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Declare end-use as industrial foil, not finished articles, to prevent misclassification
• Supply melting point and impurity analysis to prove refined copper (≥99.9% Cu)
• Package flat or in rolls without paper interleaves that mimic backing