Refined Copper Etching Foil for PCBs from Japan
Thin refined copper foil, 0.035mm thick, used in printed circuit board manufacturing for etching conductive traces. It falls under HTS 7410.11.00.00 as unbacked foil of refined copper with thickness not exceeding 0.15mm. The high purity ensures excellent conductivity and etchability.
Duty Rate — Japan → United States
51%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• Verify copper purity meets 'refined copper' standards via assay certificates to avoid reclassification
• Measure thickness excluding any temporary handling layers; provide caliper test reports
• Ensure no adhesive backing; declare as 'not backed' with photos or cross-sections if audited