7409.90.50.30/Beryllium Copper Panel for EMI Shielding/Japan

Beryllium Copper Panel for EMI Shielding from Japan

Conductive beryllium copper panels 1.2 mm x 700 mm wide for electromagnetic interference shielding in electronics enclosures. HTS 7409.90.50.30 applies to this beryllium copper form factor: plates/sheets 0.15-5 mm thick, 500 mm+ width.

Duty Rate — Japan → United States

11.7%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Document shielding effectiveness specs; classify pre-cut panels carefully vs stock; comply with ITAR if defense-related shielding