Lead-Free Solder-Plated Flat Steel Wire for Electronics from Japan
Flat mild steel wire plated with lead-free tin-silver solder alloy, 0.8mm x 4.5mm, for automated soldering in circuit board assembly. HTS 7217.30.15.60 captures this as other base metal coated flat nonalloy wire. Solder plating enables direct SMT component attachment.
Duty Rate — Japan → United States
50%
Rate breakdown
9903.82.0250%Except as provided for in headings 9903.82.14, 9903.85.67 and 9903.85.68, articles of aluminum, of steel or of copper and derivative aluminum or steel articles, as provided for in subdivisions (c)(i)–(v) of U.S. note 16 to this subchapter
9903.05.900%Articles already subject to Section 232 (steel/aluminum/copper + derivatives, autos + parts, wood, medium/heavy vehicles + parts, semiconductors, patented pharma) — U.S. note 52(f)
Import Tips
• RoHS compliance docs verify lead-free status for electronics end-use
• Solder alloy composition analysis prevents reclassification as simple tin plating
• Electronics assembly sets risk Chapter 85 classification if including components