Gold Wire Drawing Scrap from Japan
Swarf, turnings, and short ends from fine gold bonding wire production for semiconductors. HTS 7112.91.0100 as pure gold scrap for remelt recovery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Maintain 99.99% purity certification for semiconductor-grade scrap
• Vacuum pack to preserve fine wire integrity against powder classification
• Volume-based valuation using current gold wire market quotes