Gold Wire Drawing Scrap from Japan
Swarf, turnings, and short ends from fine gold bonding wire production for semiconductors. HTS 7112.91.0100 as pure gold scrap for remelt recovery.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Maintain 99.99% purity certification for semiconductor-grade scrap
• Vacuum pack to preserve fine wire integrity against powder classification
• Volume-based valuation using current gold wire market quotes