Gold-Clad Copper Foil from Japan
Thin copper foil (under 0.15mm) clad with gold on one side for flexible circuits and RF shielding. Qualifies for HTS 7109.00.00.00 as base metal clad with gold in semi-manufactured foil form, mechanically affixed per note 7.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include foil thickness and cladding ratio in commercial invoice to support semi-manufactured status
• Test for adhesion strength if challenged; electroplating fails note 7 mechanical affixing test