Gold Pellets for Electronics

Small cylindrical gold pellets (99.95% pure) used in semiconductor bonding wire production. HTS 7108.12.50 covers these as other unwrought non-monetary forms, not powder. Pellets are cast and irregular enough to qualify as unwrought.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
πŸ‡¨πŸ‡³China4.1%+25.0%29.1%
πŸ‡²πŸ‡½Mexico4.1%β€”4.1%
πŸ‡¨πŸ‡¦Canada4.1%β€”4.1%
πŸ‡©πŸ‡ͺGermany4.1%β€”4.1%
πŸ‡―πŸ‡΅Japan4.1%β€”4.1%

More Specific Codes

This product may fall under a more specific subheading:

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

7108.13Lower: 14.1% vs 29.1%

If ground to powder form

Powder form (90% through 0.5mm sieve) specifically excluded from this subheading.

8544.49.90Higher: 38.9% vs 29.1%

If already bonded to electronic components

Assembled electronic parts with gold shift to Chapter 85 electrical machinery.

7110.49.00Lower: 25% vs 29.1%

If alloyed with >2% platinum

Per chapter note 5(a), alloys with 2%+ platinum classified as platinum alloys.

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Import Tips & Compliance

β€’ Certify industrial end-use with buyer contracts to confirm non-monetary status

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