Royal Canadian Mint 99.95% Gold Wafer from Japan
Thin 99.95% pure gold wafers used in electronics plating and dental applications, in sheet-like unwrought form. HTS 7108.12.50.10 covers this high-purity nonmonetary semi-manufactured gold not qualifying as foil.
Duty Rate — Japan → United States
4.1%
Rate breakdown
9903.03.030%Articles the product of any country, as provided for in subdivision (aa)(ii) of U.S. note 2 to this subchapter
Import Tips
• Measure thickness to confirm not under foil threshold (0.18mm rolled)
• Include end-use statements for industrial vs investment to guide classification
• Comply with REACH-like chemical regs if for plating baths